Nanosilica Filled, Optically Clear Epoxy Features Superior Electrical Insulation Properties
Master Bond EP113 is a nanosilica filled epoxy that delivers enhanced dimensional stability and exceptionally low shrinkage upon curing. This optically clear, two component system is well suited for applications in the aerospace, electronic and OEM industries.
Featuring an ultra low mixed viscosity of 80-140 cps, EP113 can be readily mixed using a 100 to 80 ratio by weight. It has a long working life of 2-3 days for a 100 gram batch. It should be noted that EP113 requires oven curing. Its low viscosity combined with its superb electrical insulation profile makes this product well suited for potting, encapsulating, coating and sealing. EP113 adheres well to many substrates including metals, composites, glass, ceramics and plastics.
As a toughened system, it has good resistance to rigorous thermal cycling and shock. EP113 offers a high strength profile with a tensile strength ranging from 12,000-13,000 psi and a compressive strength of 24,000-26,000 psi. This formulation is serviceable over the wide temperature range of -100°F to +450°F. Additionally, EP113 offers chemical resistance to water, oils, acids, bases and fuels.
EP113 is available for use in ½ pint, pint, quart, gallon and 5 gallon kits. It has a shelf life of 1 year at room temperature in its original, unopened containers.
Master Bond Dimensionally Stable Adhesives
EP113 is a low viscosity, optically clear, toughened system for potting and encapsulation applications. This nanosilica filled epoxy offers excellent toughness and dimensional stability. Read more about Master Bond’s dimensionally stable adhesive systems at http://www.masterbond.com/properties/dimensionally-stable-epoxy-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: email@example.com.